2021 IEEE International Test Conference in Asia (ITC-Asia 2021)

As the number of 3D-IC stacks increases, defects of through silicon via (TSV) in manufacturing and bonding process seriously affect the yield and reliability of the chip. Comparing to discarding these defective ones, some fault-tolerant architectures are proposed, however, these existing schemes have great hardware overhead. In the paper, an N:1  single-channel time division multiple access (TDMA) fault-tolerant technique using redundant TSV to tolerate TSV defect is proposed. Data is grouped and transmitted through TSV by TDMA mechanism, which reduces the number of TSV. The number of groups depends on bandwidth and hardware. The N: 1 single-channel TDMA structure is designed to use a single TSV to accomplish the time-sharing transmission of a group of signals. Each signal TSV is equipped with an additional TSV to improve the fault-tolerant coverage. The functions are verified on 40 nm Xilinx virtex-6 FPGA. The simulation results of Design Compiler based on 45 nm PTM show that the fault coverage rate can be increased to 100%, and the area overhead is reduced by 60.8% compared with the existing methods

3D-IC;fault tolerant design;single-channel;time division multiple access