Life-Time Reliability for Memory Devices in AI Chip
ID:5 View Protection:ATTENDEE Updated Time:2021-08-17 16:09:07 Hits:715 Keynote speech

Start Time:2021-08-19 10:30(Asia/Shanghai)

Duration:45min

Session:PS Plenary Session(Openning, Keynotes 1-6) » PS1Openning and Keynote 1/2/3

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Abstract
This talk covers the life-time reliability challenges for massive numbers of memory devices used in data center, especially in AI computing servers. We will break down the challenges into several phases and indicate the potential directions to solve the issue. This includes the supplier quality control and effective communication, system level qualification and manufacturing screening strategy, and the most important, the RAS strategy and technologies when products are in service. The trade-off between product reliability, performance and cost is also considered.
Keywords
Speaker
XinLi Gu
Chief Architect Reli Huawei Technology Co., Ltd.

Xinli Gu has been a Chief Architect Reliability with Huawei Technologies, Co. Ltd. since 2011. He is responsible for Data Center AI Computing & Storage product reliability solutions. He was a director with Cisco Systems, Inc. in 1998 to 2011, responsible for corporate level design solutions for product quality and reliability, and automated manufacturing test and diagnosis. Xinli also worked for Synopsys in California and Ericsson in Sweden. He received BSc in Computer Science from Shanghai JiaoTong University, and MSc/PhD in Computer Science and Information from Linkoping University, Sweden. He has published 50+ technical papers and holds several US patents. He is an active IEEE member leading system/ASIC/test/reliability areas.
 

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Important Date
  • Conference Date

    Aug 18

    2021

    to

    Aug 20

    2021

  • May 10 2021

    Draft paper submission deadline

  • Aug 16 2021

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  • Aug 19 2021

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  • Aug 20 2021

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Tongji University
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