Introduction

The ICSICT-2022 conference is the 16th in the series aiming to provide an international forum for the presentation and discussion of recent advances in solid-state and integrated circuit technology. The conference will be held on Oct.25-28, 2022 in Nanjing, China. All aspects of solid-state devices, circuits, processing technologies, materials and other related research are within the scope of the conference. The three days of contributed and invited presentations on the latest developments in diverse fields given in oral and poster sessions, panel discussions on leading edge technology issues, and other activities will provide extensive opportunities for technical information exchange as well as a stimulating environment for mutual communication among participants. Excellent Student Paper Award will be presented at the closing of the conference.
Sponsor Type:3; 9

Committee

ICSICT 2022 ORGANIZING COMMITTEES

Name

Affiliation

Country
/Area

Life Honorary Chair

Yangyuan Wang

Peking University

China

General Co-Chairs

Jan Van der Spiegel

University of Pennsylvania

USA

Wei Zhang

Fudan University, National IC Innovation Center

China

Bin Zhao

Fairchild

USA

Shaofeng Yu

Fudan University, National IC Innovation Center

China

Yi Shi

Nanjing University

China

Advisory Committee Co-Chairs

Ru Huang

Southeast University

China

Chenming Hu

UC Berkeley

USA

Cor Claeys

KU Leuven

Belgium

K.N.Tu

UCLA

USA

Technical Program Committee Co-Chairs

Fan Ye

Fudan University

China

Xinran Wang

Nanjing University

China

Hiroshi Iwai

Tokyo Institute of Technology

Japan 

Francois Rivet

University of Bordeaux

France

Haruo Kobayashi

Gunma University

Japan

Yong Lian

Shanghai Jiao Tong University

China

Ming Li

Peking University

China

Yi Zhao 

Zhejiang University

China

Steering & Organizing Committee Co-Chairs

Mengqi Zhou

IEEE Beijing Section

China

Ting-Ao Tang

Fudan University

China

Huihua Yu

Fudan University

China

Publicity Co-Chairs

Qiang Wu

Fudan University

China

Jiting Sheng

Fudan University

China

Rui Yin

National IC Innovation Center

China

Min Xu

Fudan University

China

Secretary General

Xiaona Zhu

Fudan University

China

Call for paper

Important date

2022-06-30
Abstract submission deadline

Submission Topics

The Scope and Topics of the Conference

Papers are solicited in, but not limited to the following areas

 VLSI Technologies
1     Advanced CMOS Logic Devices

2     Advanced Process Technologies

3     Advanced Interconnect Technologies

4     Power Devices Technologies

5     2D Devices & Technologies

6     Thin Film Devices and Technologies

7     Compound Semiconductor Technologies

8     Microwave, Millimeter Wave and Analog

9     New Non-Volatile Memory Technologies

10    Flash & 3D Memory Technologies

11    Optoelectronics and Silicon Photonics

12    Sensor, MEMS, and Bioelectronics

13    Emerging Semiconductor Materials & Devices

14    3D Integration

15    Device Technologies for New Computing System

16    Advanced & Heterogeneous Packaging

17    Logic and Power Device Reliability

18    Memory Device Reliability

19    Back-End of Line Reliability & ESD

20    Device Modeling & Simulation

21    Process Modeling & Simulation

22    Design & Technology Co-Optimization

VLSI Circuits & ICCAD

23    Digital Module & Circuit

24    Analog Module & Circuit

25    Mixed-Signal Circuit & ADC/DACs

26    RF Module & Circuit

27    Memory Circuits

28    SoC For IoT and other applications

29    Processor & Advanced Computing System

30    Efficient AI Circuit

31    Wireline and Optical Communication Circuit

32    FPGA Circuits

33    Advanced Clock

34    Signal Processing

35    Chip Test and Reliablity

36    EDA Technology for Circuit Design

 

Guidlines

Prospective authors are requested to submit 3 pages camera-ready full length paper in English for proceedings publication. The proceedings will have an IEEE catalogue number and will be collected in IEEE publication database ---- IEEE X' plore.

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Important Date
  • Conference Date

    Oct 25

    2022

    to

    Oct 28

    2022

  • Jun 30 2022

    Abstract Submission Deadline

  • Oct 28 2022

    Registration deadline

Sponsored By
IEEE Beijing Section
Fudan University