The IEEE International Conference on Flexible, Printable Sensors and Systems (FLEPS 2023) will be held in Boston, Massachusetts, USA.
Sponsor Type:1
Organic/Inorganic Electronics and Sensors
Emerging Materials for Flexible and Printable Systems
Advanced Manufacturing Techniques
High-throughput Printable Electronics
Hybrid Flexible Sensors and Electronics
Stretchable/Shrinkable Sensors and Electronics
Soft/Smart Wearable and Implantable Sensing Systems
Disposable/Reusable Sensors and Electronics
Printed Large-Area Sensors and Systems
Active and Passive Components (e.g. actuators, printed energy devices, smart labels, RFID etc.)
Emerging applications of Flexible Electronics inc. IoT, smart cities etc.
Reliability, Simulation and Modelling
Flexible/Printable Electronics in context with Circular and Green Electronics
Jul 09
2023
Jul 12
2023
Draft paper submission deadline
Draft Paper Acceptance Notification
Registration deadline
2022-07-10 Austria Vienna
2022 IEEE International Conference on Flexible and Printable Sensors and Systems2021-06-20 United Kingdom Manchester
2021 IEEE International Conference on Flexible and Printable Sensors and Systems
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