Introduction

The IEEE International Conference on Flexible, Printable Sensors and Systems (FLEPS 2023) will be held in Boston, Massachusetts, USA.

Sponsor Type:1

Call for paper

Important date

2023-02-20
Draft paper submission deadline
2023-03-31
Draft paper acceptance notification

Submission Topics

Organic/Inorganic Electronics and Sensors
Emerging Materials for Flexible and Printable Systems
Advanced Manufacturing Techniques
High-throughput Printable Electronics
Hybrid Flexible Sensors and Electronics
Stretchable/Shrinkable Sensors and Electronics
Soft/Smart Wearable and Implantable Sensing Systems
Disposable/Reusable Sensors and Electronics
Printed Large-Area Sensors and Systems
Active and Passive Components (e.g. actuators, printed energy devices, smart labels, RFID etc.)
Emerging applications of Flexible Electronics inc. IoT, smart cities etc.
Reliability, Simulation and Modelling
Flexible/Printable Electronics in context with Circular and Green Electronics

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Important Date
  • Conference Date

    Jul 09

    2023

    to

    Jul 12

    2023

  • Feb 20 2023

    Draft paper submission deadline

  • Mar 31 2023

    Draft Paper Acceptance Notification

  • Jul 12 2023

    Registration deadline

Sponsored By
IEEE Sensors Council