2023 IEEE 32nd Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS)

System-level, board-level, package-level and on-chip interconnects
High-speed channels, links, backplanes, serial and parallel interconnects, SerDes
RF/microwave/mm-wave packaging structures and components, antenna-in-package and RFIC co-design
Signal and thermal integrity
Power integrity and power distribution networks
Low power mobile and personal applications
Memory and DDR interfaces
Jitter and noise management
Electronic packages and microsystems
Heterogeneous integration, 2.5D/3D interconnects and packages, TSVs and MCMs
Electromagnetic (EM) and EM interference modeling, simulation algorithms, tools, and flows
Macromodeling and model order reduction as it applies to electrical analysis
Advanced and parallel CAD techniques for signal, power, and thermal integrity analysis
Measurement and data analysis techniques for system‐level and on‐chip structures
High volume testing for electronic packages.