Introduction
AboutAerospace; Bioengineering; Communication, Networking and Broadcast Technologies; Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; Fields, Waves and Electromagnetics; General Topics for Engineers; Power, Energy and Industry Applications; Transportation
Keywords:Electromagnetic Compatibility,Electromagnetic Interference,Signal Integrity,Power Integrity,EMC Measurements,Nanotechnology,Integrated Circuits,Automotive Electronics,Computational Electromagnetics.
Scope:All aspects of electromagnetic compatibility (EMC) as well as Signal and Power Integrity (SI/PI), including but not limited to EMC/SI/PI design, modeling, management, measurements and education.
Sponsor Type:1; 3; 9
Keywords:Electromagnetic Compatibility,Electromagnetic Interference,Signal Integrity,Power Integrity,EMC Measurements,Nanotechnology,Integrated Circuits,Automotive Electronics,Computational Electromagnetics.
Scope:All aspects of electromagnetic compatibility (EMC) as well as Signal and Power Integrity (SI/PI), including but not limited to EMC/SI/PI design, modeling, management, measurements and education.
Sponsor Type:1; 3; 9
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Important Date
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Conference Date
May 22
2023
toMay 25
2023
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May 25 2023
Registration deadline
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