Introduction
AboutComponents, Circuits, Devices and Systems; Photonics and Electrooptics
Keywords:photonics, reliability,heterogeneous integration,
Scope:This major Silicon Valley symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.
Sponsor Type:1
Keywords:photonics, reliability,heterogeneous integration,
Scope:This major Silicon Valley symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.
Sponsor Type:1
Call for paper
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Important Date
-
Conference Date
Nov 16
2023
toNov 17
2023
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Nov 17 2023
Registration deadline
Sponsored By
IEEE Electronics Packaging Society
Contact Information
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