Introduction
About Communication, Networking and Broadcast Technologies; Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; Fields, Waves and Electromagnetics
Keywords:Reconfigurable Radio & Wireless Connectivity,Systems and Circuits,Low Power Transceiver ICs,Receiver Sub-Systems and Circuits,Reconfigurable and Tunable Front-Eng ICs,Transmitter Sub-Systems and Power Amplifiers,Millimeter-and Sub-Millimeter Wave Systems ICs,,
Scope:RFIC is the premier IC Conference focused on the latest developments in RF Microwave, and Millimeter Wave Integrated Circuit Technology and Innovation
Sponsor Type:1; 1; 1
Committee
General Chair
Donald Y.C. Lie, Texas Tech. Univ.
Technical Program Chair/Co-Chair
Danilo Manstretta, Univ. of Pavia
Hua Wang, ETH Zurich
Student Chair
Francois Rivet, Univ. of Bordeaux
Industry Chair
Debopriyo Chowdhury, Broadcom Corp.
Publications Chair/Co-Chair
Steven Turner, BAE Systems
Jennifer Kitchen, Arizona State Univ.
Systems & Applications Forum Chair
Gernot Hueber, Silicon Austria Labs
Transactions JSSC Guest Editor
Hossein Hashemi, Univ. of Southern California
Transactions TMTT Guest Editor
Jane Gu, Univ. of California, Davis
Workshops Chair/Co-Chair
Bodhisatwa Sadhu, IBM Research
Amin Arbabian, Stanford Univ.
Panel Sessions Chair
Oren Eliezer, Ambiq
Publicity Chair
Mona Hella, Rensselaer Polytechnic Inst.
Asia Pacific Liaison
Kenichi Okada, Tokyo Inst. of Tech.
European Liaison
Yao-Honh Liu, IMEC
Secretary
Margaret Szymanowski, Crane Aerospace & Electronics
Session Organization Chair
Joseph Cali, Raytheon Technologies
Visa Letters
Zaher Bardai, IMN Epiphany
Website Chair
Michael Oakley, Raytheon Technologies
Call for paper
All Comments
Important Date
-
Conference Date
Jun 15
2025
toJun 17
2025
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Jun 17 2025
Registration deadline
Sponsored By
IEEE Microwave Theory and Technology Society
IEEE Solid-State Circuits Society
Contact Information
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