Heat-Electric Field Conversion Model for Measuring Current Density: A Combined Simulation and Experimental Study
ID:79 View Protection:ATTENDEE Updated Time:2024-10-23 10:38:34 Hits:715 Oral Presentation

Start Time:2024-11-02 09:50(Asia/Shanghai)

Duration:20min

Session:P2 Parallel Session 2 » P2-2Parallel Session 2(November 2 AM)

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Abstract
The distribution of current density is crucial for the performance, reliability, and thermal management of electronic devices and conductive materials. Based on heat conduction theory and Joule's law, this paper establishes a model for converting the thermal field to current under AC heat sources and proposes a non-contact method for measuring current density. This method uses an infrared thermal imager to extract temperature distribution and indirectly derive current density, offering high spatial resolution. By separating steady-state periodic variations from transient temperature rises in the distribution, finite element simulations confirmed the proposed coupling between thermal and electric fields, revealing that the amplitude of temperature variations at twice the current frequency is positively correlated with current amplitude and inversely correlated with frequency. The results show that high-resolution temperature distributions obtained via infrared thermography can quantitatively detect current density distribution, aiding in reliability analysis of electronic devices and conductive materials, with significant potential applications in materials science and electrical engineering.
 
Keywords
Infrared thermal camera, Current density, Thermal field-electric field coupling, Non-contact measurement
Speaker
RenChao
Dr. Chengdu Aircraft Industrial (Group) Co., Ltd.

Submission Author
RenChao Chengdu Aircraft Industrial (Group) Co., Ltd.
XuZhichao Ltd;Chengdu Aircraft Industrial (Group) Co.
ZhuXusheng Chengdu Aircraft Industrial (Group) Co., Ltd
AoQingyang Ltd;Chengdu Aircraft Industrial (Group) Co.
ZhangXu Chengdu Aircraft Industrial (Group) Co., Ltd
XiaoJing Chengdu Aircraft Industrial (Group) Co., Ltd
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Important Date
  • Conference Date

    Oct 31

    2024

    to

    Nov 03

    2024

  • Sep 30 2024

    Draft paper submission deadline

  • Nov 12 2024

    Registration deadline

Sponsored By
Anhui University
Xi’an Jiaotong University
Harbin Institute of Technology
IEEE Instrumentation & Measurement Society