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Introduction

2024 International Symposium on Integrated Circuit Design and Integrated Systems (ICDIS2024) will be held in Xiamen, China during November 22-24, 2024.

The conference will provide a platform for all industry insiders and scholars from all over the world, where researchers, engineers and students from industry, universities and government institutions will present their latest work and discuss many applications of Integrated circuit design and integrated systems.

Call for paper

ICDIS2024 invites the submission of original research papers in the fields of theoretical, experimental, and applied cyber security and information engineering to be published in the conference proceedings. Each submission is anonymously reviewed by an average of three independent reviewers, to ensure the final high standard and quality of submitted papers. Accepted papers will be presented as either oral or poster at the conference.

All accepted and registered papers will be included in International Conference Proceedings, which will be published by ACM, and sent to EI Compendex and Scopus for indexing.

Submission Topics

Analog, Digital, Mixed, and RF Circuits Design

Low Power Tools and Designs Techniques

Sequential Logic Circuit Design

Design of CMOS Combinatorial Logic Gate CMOS

Memory and Array Structure Design

VLSI Design

Silicon / Germanium Devices and Device Physics

Modeling and Simulation of Organic Semiconductor Devices

Test, Fault Tolerance, Reliability and Modelling

Interconnect, Low K, High K and Other Process Technologies

Integrated Circuits CAD, DFM

Signal De-Noise and Processing and Optimization

Highly Integrated Front-End Circuits and Devices

Integrated Circuits for Communications

Physical Design of Integrated Circuits and Systems

Devices and Circuits for Wireless Systems

Devices, Hardware and Methods for Bio-Inspired and Neuromorphic Computing

Manufacturing, Processing, Packaging and Testing Technology of Integrated Circuits and Devices

Electronic Design Automation (EDA)

Data Path in Digital Processor Architecture

Embedded / Multiprocessor Systems

Hardware-Software Co-Design and Co-Verification

Guidlines

-All submissions must be in English with a varying length from 4 to 8 pages including figures and references, adhere to the template format in the conference website, and must be sent to the email: icdis@acamail.org

-Authors must complete their submissions before the designated deadlines. Late submissions will not be considered. The initial and final submissions must be in editable format. Hardcopy is not accepted.

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Important Date
  • Conference Date

    Nov 22

    2024

    to

    Nov 24

    2024

Sponsored By
University of Campinas
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