New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.
The Symposium calls for papers in the following areas:
Advanced CMOS Platforms, Interconnect and Backside Power Delivery Network (BSPDN) Technologies
Advanced packaging, Chiplet and Heterogeneous Integration Technologies Including 2.5D and 3D
Analog and Mixed-Signal Circuits
Beyond CMOS Devices That Utilize New Physics Including Spin, Optical and Quantum Computing
Biomedical devices, circuits, and systems
Computing / Processing in Memory
Data converters
Device physics, Characterization, Modeling and Reliability
Devices and Accelerators for ML/DL and New Compute
Digital Circuits, Hardware Security, Signal Integrity, IOs
DTCO and Design Enablement
Frequency Generation and Clocking Circuits
Memory Technologies, Devices, Circuits, and Architectures
Power Management Devices and Circuits
Processes and Materials for CMOS Scaling and New Devices
Processors and SoCs
Sensors, Imagers, IoT, MEMS, Display Circuits
Wireless and RF Devices Circuits and Systems
Wireline and Optical Transceivers, Optical Interconnects
Jun 14
2026
Jun 18
2026
Registration deadline
2021-06-13
2021 Symposium on VLSI Technology and Circuits2017-06-05 Japan Kyoto,Japan
2017 Symposium on VLSI Technology and Circuits
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