Introduction

The topics of this conference cover reliability, and failure analysis of electronic devices and systems, specifically: A) techniques and methodologies for assessing and enhancing the reliability of electronic devices and systems. B) failure mechanisms specific to silicon-based and nanoelectronic technologies. C) advances in failure analysis techniques and defect characterization. D) reliability of microwave and compound semiconductor devices, including wide bandgap materials such as GaN and SiC. E) packaging and assembly reliability, with an emphasis on electrical and mechanical modeling and simulation. F) is dedicated to power devices and microelectronic systems. G) reliability of photonic and optoelectronic components, encompassing solar cells, display technologies, and organic electronics. H) reliability of MEMS, MOEMS, and emerging nano-sensors and bio-electronic devices. I) reliability under extreme environmental conditions.

Call for paper

Important date

2026-03-20
Draft paper submission deadline
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Important Date
  • Conference Date

    Sep 21

    2026

    to

    Sep 24

    2026

  • Mar 20 2026

    Draft paper submission deadline

  • Sep 24 2026

    Registration deadline

Sponsored By
Technische Universitat Wien
Organized By
Technische Universitat Wien