Introduction
The Institute of Electrical and Electronics Engineers - Components, Packaging and Manufacturing Technology Society (IEEE-CPMT) announces the 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials to be held at Atrium Hotel in Irvine, California from February 27th to March 1st, 2013
Call for paper

Submission Topics

Adhesives and underfills - materials & applications, advanced processes, and reliability Circuit boards, substrates, and dielectrics - advanced circuit boards and substrates, properties, and processing Encapsulants, thin films, and coatings - material
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Important Date

  • Conference Date

    Feb 27

    2013

    to

    Mar 01

    2013

  • Mar 01 2013

    Registration deadline

Sponsored By
Components, Packaging and Manufacturing Technology Society - CPMT
Contact Information
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