2026 International Workshop on Advanced Interconnects (WAI)

AboutComponents, Circuits, Devices and Systems; Fields, Waves and Electromagnetics
Keywords:interconnects,signal integrity,power integrity,electromagnetic compatibility,advanced packaging,AI for interconnect design,radio-frequency interference,
Scope:The scope of this workshop includes, but is not limited to signal integrity (SI) and power integrity (PI) of an electronic system and its components including advanced interconnects, integrated circuits, IC packages, printed circuit boards, cables, connectors, as well as other relevant electronic and microelectronic components, and SI/PI co-design. This workshop also welcomes all papers or presentations related but not limited to electromagnetic environments; interference control; electromagnetic compatibility (EMC) and electromagnetic interference (EMI) modeling; high power electromagnetics; EMC standards, methods of EMC measurements; computational electromagnetics, as applied or directly related to EMC problems; transmission lines; electrostatic discharge and lightning effects; EMC in wireless and optical technologies; EMC in printed circuit board and system design; radio-frequency interference problems; artificial intelligence based EMC/SI/PI optimization.
Sponsor Type:1; 9
Region10-Asia and Pacific