Introduction
The 2013 IEEE International Conference on Solid Dielectrics (2013 ICSD) will be held June 30th - July 4th 2013 in Bologna, Italy. The ICSD is fully (financially and technically) sponsored by the Dielectrics and Electrical Insulation Society (DEIS) of IEEE and is organized by the Department of Electrical Engineering of University of Bologna. The ICSD is an interdisciplinary forum on solid dielectrics, which provides a unique opportunity for researchers to review their collective progress, consider the latest developments and discuss the future challenges in the area of solid dielectrics.
Call for paper

Submission Topics

The conference will run for four days. Tutorial sessions will be held on the first day of the conference. Papers are invited in all areas of solid dielectrics with a focus on the following areas: Conduction, polarization and breakdown Space charge and rel
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Important Date

  • Conference Date

    Jun 30

    2013

    to

    Jul 04

    2013

  • Jul 04 2013

    Registration deadline

Sponsored By
IEEE Dielectrics and Electrical Insulation Society
Contact Information
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