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Introduction

Micro-nano is considered as an emerging high technology for the 21 century. It involves various high-tech fields including electronics, machinery, materials, manufacturing, testing, and disciplines of physical, chemical and biological. A lot of remarkacble achievements have been made in the past few years. Still it is expected that the emerging novel ideas will change people’s way of thinking. The aim of CSMNT is to bring together Chinese and International players in micro/nano science and technology under one roof. It is an opportunity to further explore both theoretical and practical issues in micro-nano science and technology and its applications. It also provides one platform for both researchers and practitioners to exchange ideas and establish collaboration. The 16th annual conference and the5thinternational conference of the Chinese society of micro-nano technology will be held in Chengdu, China. Chengdu, capital of Sichuan province in Southwest China, is one of the most modern and prosperous cities in china. The fertile Chengdu Plain, on which Chengdu is located, is also known as the “Country of heaven”. Being the birthplace of one of china’s 4 leading cuisines in china-Sichuan Cuisine, Chengdu is widely recognized as the “Land of Abundance and Capital of Great Food” and was crowned the UNESCO City of Gastronomy of the World in 2010, the first one in Asia.

Call for paper

Important date

2014-04-30
Abstract submission deadline
2014-08-30
Draft paper submission deadline

Submission Topics

中国微米纳米技术学会第十六届学术年会暨第五届国际会议,将于2014年8月31日至9月3日在成都召开。本次会议由中国微米纳米技术学会主办,中国工程物理研究院、中国电子科技大学承办,成都新材料产业研究院协办,教育部、科技部、工信部、国家自然科学基金委员会、国家纳米科技中心、中国科学技术协会、国家纳米技术与工程研究院共同支持。年会的目标是为国内外微纳科技工作者提供一个就微纳技术科研和产业化进行深入探讨的契机,搭建科研人员与企业交流合作的平台。 重要日期: 1.论文摘要(中英文均可
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Important Date
  • Conference Date

    Aug 31

    2014

    to

    Sep 03

    2014

  • Apr 30 2014

    Abstract Submission Deadline

  • Aug 30 2014

    Draft paper submission deadline

  • Sep 03 2014

    Registration deadline

Sponsored By
成都新材料产业研究院
Organized By
中国工程物理研究院
中国电子科技大学
Supported By
成都新材料产业研究院
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