Call for paper 〔OPEN〕

My submissions

Registration 〔OPEN〕

My tickets

〔CLOSED〕
Introduction
One of the technology trends of the electronics industry is the rapid development and ever-increasing application of advanced simulation methodologies and tools. For the leading global companies, simulation is becoming a daily practice, a standard tool, and an important competitive edge to achieve competitive product and/or process development. Thermal, thermo-mechanical and mechanical simulations have significant impact on the business profitability of electronics industries. On the other hand, the fascinating development of the electronics industry has also formulated many challenges and impulse for the further development of simulation methodologies and tools. As the only international conference specially dedicated to thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems, EuroSimE was initiated in 2000 with major sponsorship from the European Community. The 15th in the series, EuroSimE 2014 aims to: promote further development and application of simulation methodologies and tools for the electronics industry, improve communication and exchange information between methodology & tool-developers and industry users, strengthen co-operation between industry, universities, and research institutes. EuroSimE 2014 will be held in the city of Ghent, Belgium, on April 7-8-9th 2014 with imec as local organiser (B. Vandevelde).
Call for paper

Important date

2014-02-16
Draft paper submission deadline

Submission Topics

EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems. This includes, but is not limited to: mechanical
Submit Comment
Verify Code Change Another
All Comments
Important Date
  • Conference Date

    Apr 07

    2014

    to

    Apr 09

    2014

  • Feb 16 2014

    Draft paper submission deadline

  • Apr 09 2014

    Registration deadline

Sponsored By
IEEE Components, Packaging and Manufacturing Technology Society
Contact Information