Introduction
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE. The 2014 ECTC will be held at the Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, Florida, USA.
Call for paper
Submission Topics
Advanced Packaging
Session 1: Interposer Technologies
Session 8: Flip Chip Packaging & Advanced Substrate
Session 13: 3D Process Integration & Die Stacking
Session 21: Wafer-Level & Fan-Out Packages
Session 27: Sensors & MEMS Technologies
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Important Date
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Conference Date
May 27
2014
toMay 30
2014
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May 30 2014
Registration deadline
Sponsored By
IEEE Components, Packaging and Manufacturing Technology Societ
Contact Information
Previous Conferences
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2031-05-22 United States
2031 IEEE 81st Electronic Components and Technology Conference -
2030-05-26 United States Denver
2030 IEEE 80th Electronic Components and Technology Conference -
2028-05-29 United States
2028 IEEE 78th Electronic Components and Technology Conference -
2027-05-31 United States Las Vegas
2027 IEEE 77th Electronic Components and Technology Conference -
2021-06-01 United States
2021 IEEE 71st Electronic Components and Technology Conference -
2021-06-01 United States San Diego
2021 IEEE 71th Electronic Components and Technology Conference -
2020-05-26 United States Lake Buena Vista,USA
2020 IEEE 70th Electronic Components and Technology Conference -
2019-05-25 United States Las Vegas,USA
2019 IEEE 69th Electronic Components and Technology Conference -
2018-05-29 United States
2018 IEEE 68th Electronic Components and Technology Conference -
2017-05-30 United States Orlando
2017 IEEE 67th Electronic Components and Technology Conference
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