We invite you to participate in the 7th International Silicon-Germanium Technology and Device Meeting (2014 ISTDM) to be held June 2 – 4, 2014 in Singapore. Your participation will add to the vibrant atmosphere of intellectual exchange at the frontier of knowledge, in a collegial environment.
Silicon-germanium (SiGe) has enabled key advancements in silicon-based microelectronics technology, including heterojunction bipolar transistors (HBTs) for RF communication and strained metal-oxide-semiconductor field-effect transistors (MOSFETs) for high- performance digital computing, and will enable more energy-efficient electronic devices in the future. The ISTDM provides a forum for researchers to present their latest results on emerging/new SiGe technology, devices, circuits, and applications. The conference will comprise invited sessions, regular oral presentations in parallel sessions, and lively poster and panel sessions. We hope that you will come to share your ideas and enjoy all that the conference and Singapore has to offer!
Call for paper
Important date
2014-02-07
Abstract submission deadline
Submission Topics
The major topics are as follows:
Materials
– Advanced Wafers/Substrates, Strain Engineering, Silicon-Germanium (SiGe), Germanium (Ge), Germanium-Tin (GeSn), III-V Semiconductors on Si-based Substrates.
Process Technology
– Epitaxy, Selective Epitaxy, Clea
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