2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS 2014)

Authors are invited to submit papers describing new technical contributions related to the broad area of electrical performance of high-performance interconnect systems, covering: Emerging and advanced issues, New design techniques and innovative architectures Novel CAD concepts, methodologies and algorithms for modeling, simulation and optimization, with emphasis on: System-level, board-level and on-chip interconnects High-speed channels, links, backplanes, serial and parallel interconnects, SerDes Low power mobile and personal applications Multiconductor transmission lines Memory and DDR interfaces Jitter and noise management Signal and thermal integrity Power integrity and power distribution networks (PDNs) Electronic packages and microsystems 3D interconnects, 3D packages, TSVs and MCMs Nano interconnects and nano structures RF/microwave packaging structures, RFICs, mixed signal modules and wireless switches Package-chip co-design Electromagnetic (EM) and EM interference modeling, simulation algorithms, tools and flows Macromodeling and model order reduction as it applies to electrical analysis Advanced and parallel CAD techniques for signal, power and thermal integrity analysis Measurement and data analysis techniques for system-level and on-chip structures.