International Conference on Ceramic Interconnect & Ceramic Microsystems Technologies

Apr. 20 - 23, 2015

· Germany

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Program

Timezone：Asia/Beijing

Program Overview

Important Date

Conference Date

Apr 20

2015

to

Apr 23

2015
Apr 23 2015

Registration deadline

Sponsored By

International Microelectronics Assembly and Packaging Society (IMAPS)

Contact Information

Anja Ziesche
ci******@ikts.fraunhofer.de
-**********
+49*********

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