11th International Conference on Device Packaging 2015

The 11th Annual Device Packaging Conference (DPC) will be held in Fountain Hills, Arizona, on March 16-19, 2015. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). IMAPS International Device Packaging Conference is one of the premier conferences held each year where the latest in packaging technology and trends is unveiled. The DPC provides the stage to showcase the best in packaging technology available today as well as those technologies soon to be released to the market. It offers the benefit of technical exchange among key international players and the opportunity to discover key business trends from internationally-known marketing analysts.