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〔CLOSED〕
Introduction

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI). Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Call for paper

Important date

2015-01-30
Abstract submission deadline

Submission Topics

Abstracts are being requested in the following areas: Applications in the Aerospace, Automotive, Oil & Gas, and Geothermal Industries Devices and applications Novel devices ASICs for high temperature applications Memories Passive components Power devices Semiconductor materials Contacts and metallizations Materials Packaging and inter connects Sealants, adhesives, solders Reliability and failure mechanisms Lifetime predictions Accelerated life testing Testing at high temperatures
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Important Date
  • Conference Date

    Jul 06

    2015

    to

    Jul 08

    2015

  • Jan 30 2015

    Abstract Submission Deadline

  • Jul 08 2015

    Registration deadline

Sponsored By
International Microelectronics Assembly and Packaging Society (IMAPS)
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