Introduction
The main purpose of this new Workshop is to bring together researchers in the field of power electronics components and packaging technologies to rapidly promote the development and commercialization of high-density and high-efficiency power converters. Papers ranging from material technologies to power converters are sought that address important challenges and present solutions to reduce the cost and size of power converters with the highest energy conversion efficiency. Of particular interest are packaging and thermal management of advanced semiconductor devices and power switch modules, integrated gate/base drivers, high-frequency magnetics, and high-temperature capacitors.
Call for paper
Submission Topics
Papers are solicited in the following topics:
● System integration and optimization
● Compact converter design techniques
● Modeling and simulation
● Materials and packaging technology
● Power semiconductor devices
● Power modules
● Gate/base drivers
● Thermal management and 3D packaging
● Electromagnetic interference
● Sensors and protection
● High-frequency magnetics
● High-temperature capacitors
● Reliability assessment and lifetime prediction
● Functional safety and product/data sheet standards
All Comments
Important Date
-
Conference Date
May 03
2015
toMay 05
2015
-
May 05 2015
Registration deadline
Sponsored By
IEEE Power Electronics Society
Contact Information
- Dr. Ty McNutt
- tm******@apei.net
- -**********
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