Introduction
The objectives of the Congress are to provide a forum for scientists and engineers from academia, research laboratories, and industry from all over the world who are involved in the field of thermal stresses to exchange ideas and to extend further cooperation among participants.
The Congress should forge cooperative links between researches and engineers by bringing them to one place where they present their achievements and conduct discussions.
Call for paper
Important date
2015-11-30
Abstract submission deadline
Submission Topics
This is a conference on thermal stresses and related topics, with particular focus on the following, but not limited to them:
- Thermal Stresses and Deformations
- Thermoelasticity and Viscoelasticity
- Thermal Stresses in
- Contact Mechanics,
- Dynamic Problems,
- Fracture and Fatigue of Heterogeneous
- Materials and Manufacturing
- Thermo-Hygro-Mechanics
- Thermo-Biomechanics
- Thermal Shock
- Continuum Thermomechanics
- Heat Conduction, Convection and Radiation
- Problems
- Experimental Methods in Thermomechanics
- Computational Methods in Thermomechanics
- Control of Thermal Structures
- Instability and Localization under
- Thermomechanic Loading
- Inverse and Optimization Methods in
- Thermomechanics
- Thermal Stresses in Smart Materials
- Thermal-Induced Fracture of Smart Materials
All Comments
Important Date
-
Conference Date
Jun 05
2016
toJun 09
2016
-
Nov 30 2015
Abstract Submission Deadline
-
Jun 09 2016
Registration deadline
Sponsored By
Department of Industrial Engineering University of Salerno, Italy
Contact Information
- : ******@gmail.com
- -**********
- +39*********
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