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Introduction

Optical and Photonic Engineering

Following the success of icOPEN2015 in Singapore, OPSS is proud to bring this well received conference to Chengdu, China for the first time.

Organised and hosted by OPSS, Sponsored by Sichuan Institute of Electronics, Sichuan University, University of Electronic Science and Technology of China, Southwest Jiaotong University and Chengdu University of Information Technology. This event will be held in Chengdu, China during September 26-30, 2016. icOPEN2016 will provide a timely platform to conduct a recap of the latest technologies and industry milestones, and promote optical and photonic engineering to a wider audience

We look forward to your participation in icOPEN2016 .

Call for paper

Important date

2016-05-09
Final paper submission deadline

会议的重点是新颖的研究成果等领域的理论研究,设计,实现,和应用程序。论文理论和仿真(实验)结果都是受欢迎的

Submission Topics

Topics of interest include, but are not limited to, the following：


OPTICS

  1. Fiber Optics
  2. Biomedical Optics
  3. Computational Optical Sensing and Imaging
  4. Optical Instrumentation
  5. Optics in Astronomy and Astrophysics
  6. Spectroscopy, Imaging and Metrology
  7. Optical Communications and Networking
  8. Artificial Vision
  9. Photorefractive Effects, Materials, and Devices System Reliability and Security

PHOTONICS

  1. Organic and Biophotonics
  2. MEMS and Nanophotonics
  3. Microwave Photonics
  4. Power Photonics
  5. Photonic and Optoelectronic Materials and Devices
  6. Photonic in Communications and Switching
  7. Ultrafast Electronics, Photonics and Optoelectronics
  8. Green Photonics
  9. Photodetectors, Sensors and Imaging Display Technology
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Important Date

  • Conference Date

    Sep 26

    2016

    to

    Sep 30

    2016

  • May 09 2016

    Final Paper Deadline

  • Sep 30 2016

    Registration deadline

Sponsored By
Sichuan Institute of Electronics
Sichuan University
University of Electronic Science and Technology of China
Southwest Jiaotong University
Chengdu University of Information Technology
Supported By
Sichuan Institute of Electronics
Sichuan University
University of Electronic Science and Technology of China
Southwest Jiaotong University
Chengdu University of Information Technology
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