The 4th International Conference SSTT 2016 will be held in the Academic Exchange Center Building of East China University of Science & Technology, Shanghai, China.
Topics
1. Small Punch Creep Testing
2. Small Punch Testing for Tensile and Fracture Behaviour
3. Non-destructive Sampling of Test Material from in Service Components
4. Determination of Actual Material Properties from in Service Components
5. Indentation and Hardness Testing
6. Other Miniature Test Techniques
7. Numerical Approach
Oct 12
2016
Oct 14
2016
Abstract Submission Deadline
Draft paper submission deadline
Registration deadline
Submit Comment