2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

VLSI Technologies

• Channel Engineering

• High-k/Metal gate Technology

• Advanced Source/Drain Technology

• Interconnect Technology

• Advanced 3D Integration

• Novel Process Technologies

• Ultra-Thin Body Transistors

• High Performance CMOS Platforms

• CMOS Like Novel Devices

• Advanced FinFETs and Nanowire FETs

• CNT, MTJ Devices and Nanowire Devices

• Low- Power and Steep Slope Switching Devices

• 2D Devices and Technologies

• Advanced Technologies for Ge MOSFETs

• Organic semiconductor devices and technologies

• Compound semiconductor devices and Technology

• Ultra High Speed Transistors, HEMT/HBT etc. 

• Photoelectron Devices

• Advanced Power Devices and Reliability

• Flash Memory

• IT Magnetic RAM

• Resistive RAMs

• Phase Change Memory

• 3-Dimensional Memory

• MEMS Technology

• Thin Film Transistors

• Sensors

• PV and Energy Harvesting

• Front End of Line (FEOL) Reliability

• Memory Reliability

• Back-End of Line and ESD Reliability

• Device Simulation & Modeling

• Process Simulation & Modeling

• Artificial Intelligence (Process & Device)

• Internet of Things  (Process & Device)

VLSI Circuits & ICCAD

• Processors

• Analog Circuits

• SOC

• PLL and CDR

• Low-Power Nyquist ADCs

• Digital Circuits Resilient

• High-Resolution and High Speed Data Converters

• Digital Chip-to-Chip and On-Die Interfaces

• Advanced Clock

• Artificial Intelligence  (Circuits & System)

• Internet of Things (Circuits & System)

• FPGA

• Memory Circuits

• Advanced Transceivers Techniques

• EDA

• RF Circuits and Systems

• Interference Robust RF Receivers

• Signal Processing

• System-Level Modeling & Simulation/Verification

• System-Level Synthesis & Optimization

• High-Level/Behavioral/Logic Synthesis & Optimization

• Fhysical Design

• DFM