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Introduction

International Conference on Solid-State and Integrated Circuit (ICSIC) is an annual conference since 2013, which aims to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Solid-State and Integrated Circuit. This conference provides opportunities for the delegates to exchange new ideas and research findings face to face, to establish business or research relations and to find global partners for future collaboration.  The previous ICSIC conferences had been held in Vancouver, Seoul, and Bali respectively.

The 4th International Conference on Solid-State and Integrated Circuit (ICSIC 2016) will be held duing November 23-25, 2016 in Chengdu, China. It is co-sponsored by Sichuan Institute of Electronics and University of Electronic Science and Technology of China.

 

All accepted papers after proper presentation and registration will be collected in the conference proceedings.

Call for paper

Important date

2016-07-15
Final paper submission deadline

Submission Topics

The 4th International Conference on Solid-State and Integrated Circuit (ICSIC 2016) will be held in Chengdu, China duing November 23-25, 2016. ICSIC 2016 aims to bring together top researchers from all around the world to exchange research findings and address open issues in all aspects of Solid-State and Integrated Circuit.
Topics: The conference is soliciting state-of-the-art research papers in the following areas of interest:
(1) Silicon integrated circuits and manufacturing
(2) Digital, Analog, Mixed Signal IC and SOC design technology
(3) Low-power, RF devices & circuits
(4) IC Computer-Aided –Design technology, DFM
(5) Silicon/germanium devices and device physics
(6) Interconnect, Low K, High K and other process technologies
(7) Advance memories technology (Flash, FeRAM, PCM，ReRAM, MRAM etc.)
(8) Unconventional and nano-electronics
(9) Organic semiconductor devices and technologies
(10) Compound semiconductor devices and circuits
(11) Displays, sensors and MEMS
(12) Semiconductor materials and material characterization
(13) Reliability
(14) Modeling and simulation
(15) Packaging and testing technology
(16) Equipment technology
(17) Solar cell & other devices for new energy sources
(18) Others

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Important Date

  • Conference Date

    Nov 23

    2016

    to

    Nov 25

    2016

  • Jul 15 2016

    Final Paper Deadline

  • Nov 25 2016

    Registration deadline

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