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Introduction

The MIXDES conference series started in Dębe near Warsaw in 1994 and has been organised yearly in different Polish cities. Next year we would like to continue the tradition of inviting you to the most attractive places in Poland and the MIXDES 2016 will take place in Lodz.
In short period of time the conference has become an important event in the Central Europe allowing to discuss the recent research progress in the field of design, modelling, simulation, testing and manufacturing in various  areas  such  as  micro-  and  nanoelectronics,  semiconductors, sensors, actuators and power devices as well as their interdisciplinary applications.

Call for paper

Important date

2016-03-01
Abstract submission deadline

Submission Topics

  • Design of Integrated Circuits and Microsystems: Design methodologies. Digital and analog synthesis. Hardware-software codesign. Reconfigurable hardware. Hardware description languages. Intellectual property-based design. Design reuse.

  • Thermal Issues in Microelectronics: Thermal and electro-thermal modelling, simulation methods and tools. Thermal mapping. Thermal protection circuits.

  • Analysis and Modelling of ICs and Microsystems: Simulation methods and algorithms. Behavioural modelling with VHDL-AMS and other advanced modelling languages. Microsystems modelling. Model reduction. Parameter identification.

  • Microelectronics Technology and Packaging: New microelectronic technologies. Packaging. Sensors and actuators.

  • Testing and Reliability: Design for testability and manufacturability. Measurement instruments and techniques.

  • Power Electronics: Design, manufacturing, and simulation of power semiconductor devices. Hybrid and monolithic Smart Power circuits. Power integration.

  • Signal Processing: Digital and analogue filters, telecommunication circuits. Neural networks. Artificial intelligence. Fuzzy logic. Low voltage and low power solutions.

  • Embedded Systems: Design, verification and applications.

  • Medical Applications: Medical and biotechnology applications. Thermography in medicine.

 

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Important Date

  • Conference Date

    Jun 23

    2016

    to

    Jun 25

    2016

  • Mar 01 2016

    Abstract Submission Deadline

  • Jun 25 2016

    Registration deadline

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