2016 International Conference on Planarization/CMP Technology

ICPT 2016 is hosted by CMP User's Group-China (CMPUG-CN). This conference will enhance the collaboration between industry and academia, manufacturers and clients, in response to the trend of rapid development of semiconductor industry. ICPT 2016 encourages the communication and exchange of ideas and opportunities.

We look forward to seeing you at ICPT 2016 and show you around the beautiful Friendship Hotel in Beijing city, China.

CMP (chemical mechanical planarization), as one of the most important processes in the semiconductor manufacturing, has been developed and improved continuously year after year. It has built a certain position in related industries, and is expanding in its applied area. From the user's point of view, technical demand is becoming higher and higher, and additional applications beyond the semiconductor area are increasing.

ICPT (International Conference on Planarization/CMP Technology), is a magnificent opportunity to have discussions on CMP technologies, including FEOL and BEOL CMP, Fundamentals of CMP, Polishing Processes, Consumables, Equipment, 3D/TSV, Metrology, Cleaning, Defect Control, Process Control, etc. The conference provides a place where every relevant researcher and engineer can get together to discuss openly and exchange information widely.