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Introduction

This Conference is sponsored by the Computers & Information in Engineering Division. It provides a forum for enhancing the practice of engineering by understanding the application of emerging technologies that impact critical engineering issues of representation, modeling, simulation, product design and product development, data exchange, management and integration of information throughout the entire engineering product and process life-cycle.Each of the four CIE Technical Committees (AMS, CAPPD, SEIKM, VES) is sponsoring technical sessions and panels focused on their topics of interest, as they are listed on the website of the CIE division. In addition to the Technical Committee topics, special symposia and topics have been set up to encourage participation in specific areas of interest to CIE members. We encourage you to visit any of the Symposium or Topic links below for more details.

Call for paper

Submission Topics

  • Advanced Modeling and Simulation (AMS General) 

  • Computer-Aided Product and Process Development (CAPPD General) 

  • Systems Engineering Information Knowledge Management (SEIKM General) 

  • Virtual Environments and Systems (VES General) 

  • AMS: Inverse Problems in Science and Engineering

  • AMS: High Performance Computing, with Emphasis on Advanced Computing Architectures and Cloud Computing

  • AMS: Computational Multiphysics Applications

  • AMS: Multiscale Material Characterization Methods and Applications

  • AMS: Uncertainty Quantification in Simulation and Model Verification & Validation

  • AMS: Simulation in Advanced Manufacturing

  • AMS/SEIKM/CAPPD: Design, Simulation and Optimization for Additive Manufacturing 

  • CAPPD: Emotional Engineering 

  • CAPPD: Human-Centric Design 

  • CAPPD: Feature Based Modeling and Assembly

  • CAPPD: Geometric Simulations and Part Modeling 

  • CAPPD/AMS: Human Modeling: Methods and Applications in Engineering 

  • SEIKM: Design Informatics 

  • SEIKM: Systems Engineering 

  • SEIKM: Knowledge Capture, Reuse, and Management 

  • DAC 6 Design for Resilience and Failure Recovery 

  • SEIKM: Smart Manufacturing Informatics Symposium

  • VES: General Technology for Augmented, Virtual & Mixed Reality 

  • VES: Interaction and Interfaces 

  • VES: New Trends in Immersive/Blended Systems 

  • VES: Game Ecosystems in Engineering

  • Graduate Student Poster Session 

  • ndustry Presentation: Computer and Information Technology Trends 

  • CAPPD Panel: Creating Multi-sensory Experience 

  • VES 2020: A Virtual Exploration in Real Usefulness 

  • SEIKM Panel: The Internet of Things and Its Impact on Driver Safety and Wellness 

  • AMS Panel: Smart Manufacturing: Industrial Internet of Things  

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Important Date

  • Conference Date

    Aug 21

    2016

    to

    Aug 24

    2016

  • Aug 24 2016

    Registration deadline

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