Introduction

The 2016 IEEE International Symposium on Electromagnetic Compatibility, sponsored by the IEEE EMC Society, featuring an embedded Signal Integrity and Power Integrity conference, is the must-attend event for EMC engineers of all levels and specialties.

The IEEE EMC Symposium provides knowledge and tools that help engineers address electromagnetic environmental effects and electromagnetic compatibility. Stay abreast of current technologies, testing and engineering methods.

 

Event Highlights

• Keynote Speaker
• Embedded SIPI Conference
• Special Focus on Military EMC
• Aerospace EMC Special Session
• Ask the Experts
• Panel Discussions

 

Benefits of Attending

• Learn EMC, Signal Integrity and Power Integrity techniques
• Three days of expert technical papers
• Two full days of practical EMC & SIPI workshops and tutorials
• Experiments and demonstrations of fundamental and advanced topics
• Exhibits! New Technologies, Instrumentation and Solutions
• Social networking, connecting and unique Ottawa culture

Call for paper

Submission Topics

Theme Topic I – Signal & Power Integrity

  • High-speed channel characterization and modeling

  • Signal/power integrity co-design and co-simulation

  • 3D IC and 3D packaging

  • Measurement techniques

  • Jitter, equalization, BER

 

Theme Topic II – EMC for Emerging Technologies

  • Wireless EMC

  • Radio-Frequency Interference

  • Smart Grid EMC

  • Nano-Materials and Silicon Photonics

  • Unmanned Aircraft Systems EMC

 

Theme Topic III – Space EMC

  • Launch vehicles

  • On-orbit platforms

  • Systems and Networks

  • Design and Mitigation for the Space Environment

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Important Date

  • Conference Date

    Jul 25

    2016

    to

    Jul 29

    2016

  • Jul 29 2016

    Registration deadline

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