2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

• P1. Advanced Packaging Technologies

 Wafer-level packaging, Panel-level packaging, Flip chip packaging, Chip scale packaging, Fan-in/Fan-out technologies, Multi-chip        modules, Fine pitch/high pin packaging solution, Other new technologies for advanced microelectronics

• P2. Power Electronices Packaging

  GaN power device, SiC power MOSFET, High voltage packages, IGBT module assembly, Low-temperature bonding, Sintered Ag/Au bonding, Solid-Liquid Interdiffusion (SLID) Bonding, Advanced cooling system, Ceramic substrate technologies (DBC, DPC, AMB..etc), High-performance passive components, High speed/integration power package

• P3. 3D Integration and Sip

  SiP (PoP, PiP), 3D integration including Through Silicon Vias (TSV), wafer thinning, wafer alignment, wafer bonding, wafer dicing, unerfill, interposer, 3D IC applications, etc.

• P4. Wearable Technologies

  Flexible electronics packaging, Advanced FPC technology, ACF/ACP bonding, Thin packaging, Low-temperature bonding, MEMS sensor packages, any advanced packaging related to IoT (Internet of Things), etc.

• P5. Interconnections & Nanotechnology

  Interconnect technologies on all packaging levels including wire bonding, flip chip and TSV connections, first-level package. Special emphasis on design and process of solder alternatives (ICP, ACP, ACF, NCP), under bump metallurgy, electromigration, micro-bump, substrate technology, novel enabling techniques, electrical performance, environmental concerns.

• P6. Modeling, Simulation & Design

  Electrical, optical, and mechanical modeling, Component-, board- and system-level reliability, Interfacial adhesion strength, Advanced testing and measurement techniques, Advances in reliability test methods and failure analysis, Design of experiment, Design optimization, Advanced numerical and analytical simulation methodologies and tools, Design rule development, Virtual prototyping in product and/or process design, From micro to macro simulation, Multi-physics simulation.

• P7. Thermal Management

  Thermal management materials, Two-phase heat transfer, Air cooling/liquid cooling, Emerging cooling technology, Thermal design/modeling, LED thermal management, Thermoelectric cooling and generation.

• P8. Advanced Sensor & Microsystems Technology(MST)

  Microsystem packaging, New MST-enabled possibilities, New sensing and actuation mechanisms, Multi-physics simulation of microsystems, New materials and processes for MST, Testing and calibration of microsystems, Sensing, actuation and control circuits on microsystems.

• P9. Advanced Materials, Automatic Process & Assembly

  Materials and Automatic processes for 2D/3D microelectronics, MEMS, sensor and microsystem packaging including adhesives, encapsulants, lead free solders and alloys, Thermal interface materials, High/low-k dielectrics and substrates, Thin films, TSV drilling/etching, Plating, Low temperature bonding, Assembly processes and Equipment for Automation.

• P10. Emerging Systems Packaging Technologies

  Renewable Energy, Energy Storage, Embedded passives & actives on substrates, Packaging solutions for RF-Microwave, flexible electronics, bioelectronics, automotive electronics, optoelectronics and Medical Electronics, Other novel system packaging technologies, Green packaging, LED & Optoelectronics packaging.

• B1. Green Materials and Process

  Green (LF, HF, energy saving, recycling) material, and green process on board manufacturing (Rigid, Flex, Rigid-Flex, Substrate)

• B2. Test, Quality, AOI, Inspection and Reliability

  Visual inspection, Structure integrity, inspection, X-ray, AOI, electrical test, failure analysis.

• B3. HDI and Embedded Technology

  Lamination for Build-up board, copper plating for Microvia filling and small PTH plugging.

• B4. Electro Deposition and Electrochemical Processing Technology

  Electro-chemical migration, PTH, Plating and etching chemical and process.

• B5. Advanced and Emerging Technology

  Optical Circuit board, SMT and Module, Electroless Plating Technology, Ink-Jet printing technology, Emerging Material, equipment and assembly technolog

• B6. Mechatronics and Automation

  • Mechatronics, robotics, automation, control systems
  • Elements, structures, mechanisms, and their applications
  • Telerobotics, human computer interaction, human-robot interaction
  • Control system modeling, simulation techniques, and control applications
  • Intelligent control, neuro-control, fuzzy control and their applications
  • Industrial process control, manufacturing process and automation (tentative)

• B7. Advanced Materials

    Low Dk, Low Df, Low CTE, High frequency application