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Introduction

This symposium, the fourth in a biannual series, reflects the increasing interest in complex high-rate roll-to-roll (R2R) technologies as scalable pathways to fabricate devices with electronic or other advanced functionalities, including transistors, memories, physical and chemical sensors, photovoltaic cells, photo detectors, energy storage devices, displays, lighting and biomimetic surfaces. Submissions are encouraged for papers describing advanced concepts comprising additive (printing, coating, ALD, PVD, CVD), transformational (curing, annealing), subtractive (laser, molding, embossing, dry-phase), patterning (nanoimprint, optical and contact lithography), and hybrid manufacturing technologies as well as novel substrate handling and alignment concepts aiming for large-area and/or high-resolution patterning. Contributions on sheet-based or wafer-based manufacturing lines with a high degree of throughput and integration are also welcome.

This symposium is designed as a truly interdisciplinary forum for materials scientists, electronic and mechanical engineers to share the latest breakthroughs on the topic and to discuss novel process workflows and devices. A special focus is laid on hybrid manufacturing technologies, including in-line reliability assessment and quality control.

Call for paper

Important date

2016-06-16
Abstract submission deadline

Submission Topics

  • Roll-to-roll (R2R) and hybrid manufacturing concepts

  • Integrated concepts for web-, sheet- and wafer-based micro- and nanofabrication

  • Novel substrate materials and substrate transport concepts

  • Electronic and advanced functional devices including systems integration

  • In-line characterization, reliability, and quality control

  • Physical and chemical materials properties

  • Biotronics for bio-interlocked sensor networks

  • Manufacturing techniques

  • Conventional and digital printing, coating and other solution processing

  • High-throughput CVD, PVD, ALD

  • Molding, embossing, lithography, laser processing

  • Nanomanufacturing (e.g. nanoimprint lithography)

  • Application areas

  • Printed electronic circuits and memories, printed NFC, RF, and antennae applications

  • Sensors, including biomedical implantable electronics for health monitoring

  • Large-area interactive and biomimetic surfaces and user interfaces

  • Organic and inorganic solution-based photovoltaics and photo detectors

  • Displays and lighting, energy storage and supply (batteries, fuel cells)

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Important Date
  • Conference Date

    Nov 27

    2016

    to

    Dec 02

    2016

  • Jun 16 2016

    Abstract Submission Deadline

  • Dec 02 2016

    Registration deadline

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