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Introduction

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.

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Important Date
  • Conference Date

    Jun 01

    2021

    to

    Jun 04

    2021

  • Jun 04 2021

    Registration deadline

Sponsored By
IEEE
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