Call for paper 〔OPEN〕

My submissions

〔CLOSED〕
Registration 〔OPEN〕

My tickets

〔CLOSED〕
Introduction

It is a great pleasure to announce that the 40th International Microelectronics and Packaging IMAPS Poland Conference will be held on 25-28 September, 2016 in Książ Castle near Wałbrzych. Please, mark your calendar.

The Conference is organized by Wrocław University of Science and Technology, Faculty of Microsystem Electronics and Photonics.

Conference language is English. Abstracts and full texts of papers should be prepared in English.

Call for paper

Important date

2016-05-15
Abstract submission deadline
2016-06-30
Draft paper submission deadline

Submission Topics

  • Hybrid and Semiconductor Technology

  • Design Methods and Computer Simulations

  • Electronics Materials and Components

  • Microcircuits Applications

  • Thick-Film and Thin-Film Sensors

  • Packaging and PCB

  • Quality and Reliability Evaluation

  • Thermal Management

  • Optoelectronics and Photovoltaics

  • Education in Electronics

Submit Comment
Verify Code Change Another
All Comments
Important Date

  • Conference Date

    Sep 25

    2016

    to

    Sep 28

    2016

  • May 15 2016

    Abstract Submission Deadline

  • Jun 30 2016

    Draft paper submission deadline

  • Sep 28 2016

    Registration deadline

Sponsored By
Edith Cowan University
Organized By
Wrocaw University of Science and Technology, Faculty of Microsystem Electronics and Photonics
Contact Information
Login to view full contact details