2017 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)

The conference will solicit papers describing original work in RFIC circuits, system engineering,design methodology, RF modeling and CAD simulation, RFIC technologies, devices, fabrication, testing, reliability,packaging and modules to support RF applications in areas such as, but not limited to:

Wireless Cellular & Connectivity ICs: LTE/LTE-Advanced, 5G Massive MIMO, LTE-M, WWAN, WLAN,802.11ax, Bluetooth, GPS

Low Power Transceivers: IoT, RFID, NFC, Zigbee, WPAN, WBAN, Biomedical, Sensor Nodes

RF Front-End ICs: LNAs, Mixers, Demodulators, VGAs, Filters, Phase shifters, switches, Full-duplex applications, and Interference cancellation

Mixed-Signal RF and Analog Baseband Circuits: ADCs, DACs, Sub-sampling/Over- sampling Circuits, and analog baseband circuitry including filters and modulators

Reconfigurable and Tunable Front-Ends: Cognitive Radio, Multi-mode advanced cellular radios, Digitallyassisted RF, and Re-configurable blocks (N-path filter, ADCs, tuners)

Large-Signal Circuits: Power Amplifiers (RF & mm-Wave), Driver amplifiers, Advanced TX circuits,modulators, efficiency enhancement, and Linearization

VCOs and Frequency Multipliers: RF and mm-Wave VCOs, Frequency Multipliers

Frequency Generation Circuits: PLLs, Synthesizers, ADPLL, DDS, Frequency Dividers, DLL, and MDLL

Modeling, CAD and Testing: RF Design Methodology, RF Modeling and CAD, EM Simulation, Co-Simulation,Testing and Analysis of Active/Passive Devices, and Built-in-Test

Process, Device and Packaging Technologies: CMOS, SOI, SiGe, GaAs, GaN, MEMS, Integrated Passives,Photonic, Emerging Devices, Reliability, Packaging, and Modules

mm-Wave Circuits & Systems: mmW SOCs and SIPs above 20GHz for data, video, and imaging, mmW frontend circuits, and mmW-based 5G systems

High-Speed Data Transceivers: Wireline, UWB, Optical Transceivers, and CDRs for High-Speed Data links