Introduction
IEEE International Interconnect Technology Conference (IITC 2017) will be held in Hsinchu, Taiwan in May 16-18, 2017.
IITC 2017 is dedicated to technology advances in the fields such as: semiconductor processing, equipment development, advanced materials and interconnect systems.
IEEE International Interconnect Technology Conference (IITC 2017) brings together professionals and researchers. The conference seeks papers on all aspects of interconnects for device, circuit board and system-level applications. The deadline for submission of abstracts is February 1, 2017.
Additional conference Information will be available mid-October, 2016.
Call for paper
Important date
Submission Topics
IEEE International Interconnect Technology Conference (IITC 2017) covers topics such as:
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Process integration, via/trench patterning
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Materials and Unit Processes
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Reliability
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Characterization
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3D Integration and TSV
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Novel Circuits and Systems for Signaling Networks-on-Chip
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Packaging
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Back-End Memories and MEMS
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Novel Materials and Concepts
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Important Date
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Conference Date
May 16
2017
toMay 18
2017
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Jan 27 2017
Abstract Submission Deadline
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Jan 27 2017
Draft paper submission deadline
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Jan 27 2017
Final Paper Deadline
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Mar 10 2017
Draft Paper Acceptance Notification
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May 18 2017
Registration deadline
Sponsored By
Contact Information
- Celia Shih
- ce******@tsia.org.tw
- 886*********
- Wendy Walker
- ww******@widerkehr.com
Previous Conferences
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2016-05-23 United States
2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference -
2013-06-13 Japan
2013 IEEE International Interconnect Technology Conference - IITC
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