Introduction

System performance continues to grow, even though device scaling is saturated. Based on strong manufacturing technologies, Asia has strong potential to take an initiative for system integration. Deep-dive discussions among technical communities on materials, processes, and devices are aimed to accelerate manufacturing innovations through this forum.

The Inaugural EDTM (Electron Devices Technology and Manufacturing) is a full three-day conference to be held at Toyama International Conference Center, Japan from February 28th to March 2nd, 2017, fully sponsored by the IEEE Electron Devices Society (EDS). As semiconductor technology scaling challenges continues to grow, so should the industries collaborative efforts to overcome them must increase. EDTM is intended to serve as a forum for the electron devices community to collaborate on topics ranging from devices, materials, and tools, to create new and innovative technologies. EDTM will provide the following new formats.

Call for paper

Important date

2016-11-20
Abstract submission deadline

Submission Topics

  • Devices and Manufacturing for "Cloud and Edge"

  • Packaging and Manufacturing for "Cloud and Edge"

  • Process, Tools, and Manufacturing

  • Materials

  • Reliability & Modeling

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Important Date
  • Conference Date

    Feb 28

    2017

    to

    Mar 02

    2017

  • Nov 20 2016

    Abstract Submission Deadline

  • Mar 02 2017

    Registration deadline

Sponsored By
IEEE
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