Introduction
The aim of the conference is to provide an international forum for the presentation and discussion of the latest advances in the fields of reliability and radiation issues on electronic materials, devices, circuits, sensors and systems. The scope encompasses technological processes and design techniques for producing radiation tolerant systems for space, aeronautical or terrestrial applications, as well as relevant methodologies for their characterization and qualification. The conference feature includes oral and poster sessions and round tables.
Call for paper
Important date
Submission Topics
We invite you to submit a presentation proposal that address any semiconductor related reliability and radiation issue, including the following topics:
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Electronic device reliability (emerging devices, defect, physical mechanism, simulations, etc.)
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Design-in reliability (circuits, systems, materials, etc.)
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Single-event effects, Total ionizing dose effects, Displacement damage effects (physical mechanism, modeling, etc.)
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Charge/Discharge effects and ESD
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Failure characterization and analysis
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Radiation hardening techniques and methodology
All Comments
Important Date
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Conference Date
May 22
2017
toMay 24
2017
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Mar 01 2017
Abstract Submission Deadline
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May 24 2017
Registration deadline
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