Introduction

APPLICATION FIELD

MOC2017 covers micro optics technologies used in optical communications, optical interconnect, optoelectronic devices, optical sensing and prosessing, displays and lighting.

The 22nd MICROOPTICS CONFERENCE covers microoptics technologies in the following major topical fields;

A. Optical Communications

Photonic networks, Optical routing, Advanced multiplexing, LAN, FTTH, etc.

B. Optical Interconnects

Chip/Board/System interconnects, Active optical cables, etc.

C. Optoelectronic Equipment

Optical storages, Laser and LED printers, Smart sensors, Advanced cameras, Advanced microscopes, etc.

D. Optical Sensing and Processing

Optics for image recognition, Physical measurements, Sensors and sensing systems, Security systems, Optical computing, Bio- and medical sensing, Tomography, etc.

E. Displays and Lighting

LCD, Laser/LED/EL displays, MEMS displays, 3D displays, Projection displays, Wearable displays, Flexible displays, Solid state lighting, Illuminations, Appearance design and control, etc.

F. New Applications and Emerging Technologies

Green photonics, Environmental and energy optics, Bio- and medical optics, Nano-photonics, Quantum systems, Next generation and intelligent microoptics, Car optics, Agricultural and fishery optics, etc.

Call for paper

Important date

2017-06-16
Abstract submission deadline
2017-07-29
Draft paper acceptance notification

Submission Topics

The category of the conference covers the following subjects of microoptics;

1)Theory, Modeling, and Design

Aberrations, Dispersion, Beam optics, Guided-wave optics, Gradient-index optics, Diffractive optics, Photonic band, Slow light, Near-field optics, Nonlinear optics, Thermooptics, Plasmonics, Metal optics, Quantum optics/photonics, Biomimetic optics, Simulation and system design, etc.

2)Materials and Fabrication

Semiconductors, Crystals, Dielectric materials, Polymers, Liquid crystals, Nonlinear materials, Composite materials, Nano-materials, Transparent conductors, Magneto-optic materials, Spin-materials, Metamaterials, Nanocarbons, etc.
Micro- and nano-fabrication, Nano-imprint, Laser processing, Heterogeneous bonding, 3D printing, etc.

3)Measurement and Sensing

Spectroscopy, Interferometry, Reflectometry, Ultrafast measurement, 3D measurement, Quantum measurement, etc.

4)Passive Devices

Fibers, Waveguides, Multi/Demultiplexers, Add-drop multiplexers, Branching and mixing components, Photonic crystals, Filters, Microlenses, Diffractive optical elements, Isolators, Polarizers, etc.

5)Dynamic and Functional Devices

MEMS, Switches, Modulators, Tunable devices, Wavelength converters, Nonlinear optical devices, Deflectors, Optical buffers, etc.

6)EO/OE and Active Devices

Lasers, LEDs, VCSELs, Array lasers, Amplifiers, Photo detectors, Terahertz devices, Optical imaging sensors, Solar cells, Energy harvesting devices, etc.

7)Integration, Packaging, and Si photonics

Monolithic and hybrid integration, Mounting and packaging, Micro-assembly, Wafer-level assembly, 3D integration, etc.

8)System and Design Conception

Submit Comment
Verify Code Change Another
All Comments
Important Date
  • Conference Date

    Nov 19

    2017

    to

    Nov 22

    2017

  • Jun 16 2017

    Abstract Submission Deadline

  • Jul 29 2017

    Draft Paper Acceptance Notification

  • Nov 22 2017

    Registration deadline

Sponsored By
Institute of Industrial Science, The University of Tokyo
Research Center for Advanced Science and Technology, The University of Tokyo
IEEE Photonics Society
Organized By
Microoptics Group, JSAP
Previous Conferences