Introduction
台湾软体工程研讨会 (Taiwan Conference on Software Engineering; TCSE) 是台湾提供产、官、学、专家与学者，研讨软体工程原理、实务与最新技术发展与研究成果的最主要园地。本次大会的主题为「Software Engineering and Data Science」，将探讨软体工程与资料科学的相关研究，包含应用软体工程技术于资料科学及应用资料科学于软体工程。大会除精选软体工程领域论文以飨与会者之外，更将邀请国内外资料科学软体技术领域的标竿人物与会，欢迎国内外软体工程界精英共襄盛举。本次研讨会将同时召开台湾软体工程学会会员大会。
Call for paper
Important date
Submission Topics
敬邀学者专家投稿符合(但不限于)下列软体工程主题之论文
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Agile software development
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Component-based software engineering
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Data analysis in software engineering
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Data science application in software engineering
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Debugging, fault localization, and repair
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Dependability, safety, and reliability
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Distributed software engineering
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Empirical software engineering
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Formal methods
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Green and sustainable technologies
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Middleware, frameworks, and APIs
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Mining software engineering repositories
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Model-driven engineering
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Open source project analysis
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Programming languages
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Refactoring
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Requirements engineering
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Reverse engineering
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Software architecture
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Software engineering education
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Software engineering for big data infrastructure
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Software engineering for clouds
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Software engineering for data product
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Software engineering for IoT
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Software engineering for mobile app
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Software engineering tools
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Software evolution and maintenance
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Software modeling and design
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Software process
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Software reuse
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Software testing
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Software visualization
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Specification and modeling languages
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Validation and verification
All Comments
Important Date
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Conference Date
Jul 07
2017
toJul 08
2017
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May 31 2017
Draft paper submission deadline
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Jul 08 2017
Registration deadline
Contact Information
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