2018 Embedded Systems Week (ESWeek)

ESWEEK 2018 introduces a dual publication model comprising two tracks, namely the Journal track and the Work-in-Progress (WiP) track. Journal-track papers, which are full-length (10-page, including references/acknowledgements) papers describing mature work, will be published in IEEE TCAD. The WiP-track papers, which are short (2-page) papers representing not-yet-mature but promising research work, will be published in the ESWEEK proceedings and will be listed as regular publications within the ACM and/or IEEE digital libraries. Authors of WiP papers have the opportunity to publish the extended final form of their work when it has matured in any conference or journal they prefer. Journal papers and WiP papers are mutually exclusive, i.e., a work can only be in submission in one of the two tracks.

For publication of all accepted papers, in both the journal and WiP tracks, the following is required:

One full, regular ESWEEK registration per paper
An in-person paper presentation at one of the conferences
A poster presentation