2017 IEEE 12th International Conference on ASIC (ASICON 2017)

Papers are solicited in, but not limited to, the following:

I.  Design Techniques

[1]  VLSI Design and Circuits

• Low power techniques, high-speed circuits

• Embedded processors and DSP

• Chaos/neural/fuzzy-logic circuits

• Programmable devices (PLD, EPLD, HDPLD, FPGA, etc)

• NoC

[2]  Analog, Mixed Signal and RF Circuits

• Data converters (ADCs and DACs)

• RF circuits(narrowband RF, ultra low power and millimeter-wave circuits (MMDS, 60GHz), RF/IF and power amplifiers, frequency generators, RF switches, power detectors, active antennas )

• Power systems and power electronic circuits

[3]  Application-Specific SoCs

• Auto-mobile electronics and Industry Control

• Biomedical circuits and systems

• Sensory systems

• Graph theory and computing

• Neural systems and Applications

• Mobile Computing

• IOT technologies.

[4] Circuits and Systems for Wireless Communications

• Receivers,transimitters technologies for wireless systems (WLAN, WPAN, WMAN, GPS, DVB/DMB,UWB, Blutooth, GSM/EDGE/CDMA/UMTS/3G/4G base stations and handsets, TV, radio, satellite)

• RFID

• ISM band systems

[5] Testing, Reliability, Fault-Tolerance

• Digital/analog/mix-signal testing

• Design for testability and reliability

• Test vector compression and silicon debug and diagnosis

• Variation-aware design

• Static and dynamic defect and fault recoverability

[6] Advanced Memory

• DRAM & SRAM  

• Flash Memory

• Ferroelectric Memory

• Phase Change Memory, RRAM, MRAM

[7] FPGA

• Tools and Design Technique for FPGA

• Architectures for FPGA

• Device technology for FPGA

• Application of FPGA

II.  CAD Techniques

[8] Circuits Simulation, Synthesis, Verification and Physical design

• Analog Circuits modeling and simulation

• Logic synthesis, simulation and formal verification

• Partitioning, placement and floor planning

• Routing and detailed physical design

[9] CAD for system, Design for Manufacturing and Testing

• Embedded systems

• Mixed technology/domain, reliable and alternative systems

• Design for manufacturability and testing

III.  New Techniques, New Processing, New Devices and Their Applications

[10] MEMS Techniques

• Piezoelectric and MEMS application

• Pyroelectric/IR/optical application

• Sensors,Chemical and Bio-Chips

[11] Nanoelectronics and Gigascale systems

• Nano Devices and NEMS

[12] New Devices: Hetrojunction Devices, Fin FET, CNT MTJ Devices,, 3-D integration, etc..

[13] Advanced Interconnection Technology, High K/Metal gate technology and other VLSL New Processing, New technologies .

[14] VLSI application for Energy generation, conservation and control

[15] Processing Modeling & Simulation

IV． Other VLSI Design and Device Related Topics

[16] Other Devices Related Topics  [17] Other VLSI Design Related Topics