Introduction

The 2017 IEEE S3S Conference will take place October 16th – 19th in San Francisco, CA. This industry-wide event gathers together widely known experts, contributed papers and invited talks focused on SOI Technology, Low-Voltage Devices/Circuits/Architectures, and 3D Integration.

A special focus area of the Conference in 2017 will be on energy efficient computation and communication to empower small systems. This is a timely topic given recent projections that the number of internet –connected devices will grow to 75 billion by 2020. Energy-efficiency is key to enabling small, battery-powered sensors and wireless connectivity hubs. The IEEE S3S organizers are pleased that the core technologies of the S3S Conference are sure to play critical roles in efficient computation and communication in energy starved systems.

Included in the conference registration is a Tutorial on 3D Technologies. On Thursday, we will also offer a full-day short course on FDSOI Circuit Design. Panel Discussions, a Poster Session and networking opportunities round out the program.

This year we have expanded the range of the “Subthreshold Microelectronics” area to “Low-Voltage Microelectronics”, as with continued device scaling and lowering of threshold voltage the most energy efficient operating point is now often near-threshold and not below threshold.

Call for paper

Important date

2017-05-22
Abstract submission deadline
2017-07-01
Draft paper acceptance notification

Submission Topics

SILICON-ON-INSULATOR (SOI)
For over 35 years our conference has been the premier meeting of engineers and scientists dedicated to current trends in Silicon-On-Insulators technology. Papers are solicited in all areas of SOI technology and related devices, circuits and applications, including:

  • Device Physics and Modeling

  • High-Voltage Devices

  • Advanced Materials, Substrates & Process Integration

  • Photonics

  • New SOI Structures, Circuits and Applications

  • Asynchronous Circuits

  • Sensors, NEMS, MEMS

  • SOI and FDSOI Manufacturability and Process Integration

  • Substrate Engineering

  • Fully-Depleted / Thin-Body Devices

  • Analog and RF Technologies

  • SOI Circuit Applications

  • Device Reliability and Characterization

  • RFID Technology and Applications

  • SOI-specific Design

LOW-VOLTAGE MICROELECTRONICS
Ultra-low-power/Ultra-low-voltage microelectronics will expand the technological capability of handheld and wireless devices by dramatically improving battery life and portability. Papers are solicited in the following technical focus areas, but research or concepts in any area of low-voltage microelectronics will be considered:

  • Unattended Remote Sensors

  • Space-Based Sensors

  • Biomedical Devices

  • Low-Voltage Handheld/wireless systems

  • Ultra-Low-Power Digital Computation

  • Analog and RF Technologies

  • Energy Management Circuits

  • Low Voltage Memory Technologies

  • Radiation Effects

  • Transistor Variability and Mitigation

  • Energy Harvesting Techniques

  • Asynchronous Circuits

  • Novel Device and Fabrication Technology

  • Robust Circuit Design

3D INTEGRATION
3D Integration, including monolithic 3D IC or sequential 3D IC, allows us to scale integrated circuits “orthogonally” in addition to classical 2D device and interconnect scaling. We will cover fabrication techniques, bonding methods as well as design and test methodologies. Novel inter-strata interconnect schemes will also be discussed. Previously unpublished papers are solicited in all of the above areas related to 3D implementation including:

  • Low Thermal Budget Processing

  • Processes for Multi Wafer Stacking

  • 3D IC EDA and Design Technology

  • Heterogeneous substrates, devices and architectures

  • 3D manufacturing and Logistics

  • Reliability of 3D Circuits

  • Cost Analysis of 3D Architectures

  • Fault Tolerant 3D Designs

Submit Comment
Verify Code Change Another
All Comments
Important Date

  • Conference Date

    Oct 16

    2017

    to

    Oct 19

    2017

  • May 22 2017

    Abstract Submission Deadline

  • Jul 01 2017

    Draft Paper Acceptance Notification

  • Oct 19 2017

    Registration deadline

Sponsored By
IEEE
Contact Information
Login to view full contact details
Previous Conferences