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Aconf Academic Conference Contribution Library
Type
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ID
Influence of CucorAl wire bonding on reliability of SiC devices
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
P /P4
2021-08-27 12:29 ~ 12:30
Public
Poster Presentation
Fang Chao
Zhuzhou CRRC Times Semiconductor Co., Ltd.