IMWS-AMP 2017 conference represents a unique and unprecedented opportunity to bring together researchers and practitioners of different background (materials scientists, chemical experts, physicists, microwave engineers and process technologists), to share the most recent advances in new materials and manufacturing processes, which represent the key for the development of future RF, microwave, mm-wave and THz devices, circuits and systems. IMWS-AMP 2017 is financially sponsored by the IEEE Microwave Theory and Techniques Society (MTT-S) and technically co-sponsored by the European Microwave Association (EuMA). The IMWS-AMP 2017 edition will be host by the University of Pavia, Italy. The conference will feature an exciting technical program, an industry exhibit, and invited talks by worldwide recognized experts in materials and manufacturing processes.
Perspective authors are cordially invited to submit papers in all areas of novel material, advanced manufacturing and processing, and integration techniques for microwave to terahertz circuits and systems, including but not limited to:
RF, microwave and THz components and circuits based on new materials
Advanced manufacturing processes
Additive manufacturing & 3D-printing
Wearable components and antennas
Organic RF electronics and devices
Components based on inkjet printing
Smart materials
Functional materials
Artificial and engineered materials
Microwave devices based on semiconductor materials
Nanomaterials (e.g., graphene, CNT)
High-speed memory materials
Bio-materials
Multiphysics modeling
Material characterization
Integration and interconnect technologies
Sep 20
2017
Sep 22
2017
Draft Paper Acceptance Notification
Draft paper submission deadline
Final Paper Deadline
Registration deadline
2025-07-23 China Qingdao
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