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Introduction

IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP 2016) is organized by the University of Electronic Science and Technology of China (UESTC). It is promoted by the MTT-S Members & Geographic Committee to complement the existing workshops of the International Microwave Symposium. The purpose of this platform is to boost technical and educational activities as well as exchanges and collaborations within the international microwave community.

IMWS-AMP 2016 will be held in Chengdu China in July 20-22, 2016. Chengdu is the provincial capital of Sichuan province in Southwest China, as well as a major city in Western China. The fertile Chengdu Plain, on which Chengdu is located, is also known as the "Country of Heaven", a phrase also often translated as "The Land of Abundance". The must-go tourist attraction in Chengdu is definitely the breeding center for giant pandas, which was founded in the north suburbs of Chengdu. It is the only one of its kind in the world that's located in a metropolitan area. (More about Chengdu.)

IMWS-AMP 2016 will feature both invited and contributed papers. Distinguished researchers will be invited to deliver keynote speeches on technology trends and significant advances in relevant topics. Contributed papers are solicited for the same topics as listed below.

Call for paper

Important date

2016-01-19
Draft paper submission deadline
2016-03-23
Draft paper acceptance notification
2016-04-13
Final paper submission deadline

Submission Topics

The topics include, but are not limited to, the following technical areas:

  • Carbon nanotubes and 2D (e.g. graphene and beyond graphene) electronic and optoelec-tronic devices

  • Wide bandgap and other emerging semiconductor materials (e.g. ionic)

  • Spin-wave and magnonic crystal materials

  • Engineered metamaterials and plasmonics for absorption, cloaking, and wave manipulation

  • Ferromagnetic materials and superconducting materials

  • Advanced silicon, integrated passive devices (IPD) and through silicon via (TSV)

  • LTCC, LCP, large area printing and inkjet printing

  • 3D printing

  • Passive/active microwave and terahertz devices (material characterization, fabrications, and applications)

  • Antennas with advanced/complex/artificial materials and processes

Guidlines

Important Notes:

  • Authors must submit the Manuscript in PDF format. 

  • The deadline for Preliminary submissions is: June 1.

  • You must use the provided IEEE two-column format that can be found in the Microsoft Word or Latex Manuscript Template.

  • You must use the IEEE PDF eXpress(Conference ID: 38065X) to convert your manuscript to an IEEE Xplore-compliant PDF or to verify that your own PDF is compatible before uploading.

  • The paper length should be 3~4 pages. No paper should exceed 4 pages.

  • There is a 2-Megabyte limit on the PDF file to be uploaded to the web site. (Sometimes authors may encounter difficulties with photographic images that are large in size. Use compression on photos and figures to reduce the size.

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Important Date
  • Conference Date

    Jul 20

    2016

    to

    Jul 22

    2016

  • Jan 19 2016

    Draft paper submission deadline

  • Mar 23 2016

    Draft Paper Acceptance Notification

  • Apr 13 2016

    Final Paper Deadline

  • Jul 22 2016

    Registration deadline

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