Introduction

New for 2017, SEMI-THERM 33 will feature a Data Center Track, an entire track dedicated to addressing the impact of thermal design of IT equipment on the performance of the modern data center.

Who Should Attend:

Attendees include anyone interested in thermal design, management and characterization of electronic systems and components. SEMI-THERM provides a forum for engineers, academics, and executives to learn, exchange ideas, and display the latest in thermal management techniques, products and services. Here are some of the topics we’ve covered in past years:

New Technologies

  • Advances in Thermal Components
  • Energy Harvesting Materials
  • Thermal Control Methods
  • 3D & Nano-Technologies

Component & System Design

  • Heat Spreaders, Air Movers, TIMs
  • Design Software & Modeling
  • Processors, ICs, Memory
  • Solid State Technologies

Testing & Validation

  • Characterization & Material Measurement
  • Instrumentation & Controls
  • Reliability Testing
  • JEDEC Standards

Applications

  • Portable & Power Electronics
  • Harsh Environments
  • Telecommunications
  • Data Centers
Call for paper

Important date

2016-09-29
Abstract submission deadline
2017-01-06
Draft paper submission deadline
2016-10-10
Draft paper acceptance notification
2017-01-06
Final paper submission deadline
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Important Date
  • Conference Date

    Mar 13

    2017

    to

    Mar 17

    2017

  • Sep 29 2016

    Abstract Submission Deadline

  • Oct 10 2016

    Draft Paper Acceptance Notification

  • Jan 06 2017

    Draft paper submission deadline

  • Jan 06 2017

    Final Paper Deadline

  • Mar 17 2017

    Registration deadline

Sponsored By
IEEE Components, Packaging and Manufacturing Technology Society